Products > Fab Processes > IBM > IBM 0.25 Micron 6RF Process
6RF CMOS Process
IBM Semiconductor 0.25 Micron
If your design will be used for production, i.e. non-MPW, please read the IBM policy described in "Checking and Error Disposition Strategy for IBM Designs."Process Description
MOSIS is offering access to the IBM 0.25 micron mixed-mode CMOS 6RF technology for prototype and low volume fabrication. C4 (IBM's flip chip bumping) is subject to availability at additional cost. Advance notice required. Please submit your inquiry through the MOSIS Support System.
A Cadence design kit (with Agilent ADS models) plus standard cell libraries and IOs are available.
This CMOS process has 5 metal layers (M1+M2+M3+MT+AM), supports stacked MiM capacitor (Q3/Q4, nitride), thick top metal.
6RF Supported Options
Please refer to the List of 6RF Supported Options page for the options available on MOSIS MPW runs in this technology. You may not submit a design containing any options or metals stack which are not listed here without prior arrangement with MOSIS. The stacked MiM option in this process also allows for single MiMs to be fabricated: you do not need to contact MOSIS about this. While the process is capable of up to 6 metal layers, we offer 5 on multi-project runs.
To ensure that submitted data is on a 10 nm grid, please stream-out at 1 DBU = 10 nm (Cadence 0.010, not 0.001).
MOSIS does not fill for IBM processes. Designs for IBM runs must meet the IBM fill requirements when submitted. RX density must pass RECOMMENDED (20%) checking.
The CAD tool support files, DRC and LVS decks, simulation files, cell libraries, and files listed on the IBM CMOS Design Kits page are the only kits and files available.
Design rules supported by this technology
Only the IBM design rules will be supported for this technology.
MOSIS Technology Codes
The technology code for the 6RF process is IBM_6RF.
Parametric Test Results and SPICE Model ParametersSee Test Results for IBM 0.25 micron runs
Reticle/Wafer Size, Steps, Die and Wafer Thickness
|Reticle Size (milli- meters, approx.)||Reticle Copies Stepped on Wafer (approx.)||
(+/- .5 mil)
Bumped Die Thickness **
(+/- .5 mil)
|Mils||Micro- meters||Mils||Micro- meters||Mils||Micro- meters|
|8||18 x 20||60||10||250||10||250||30||760|
** Die thickness only. Does not include height of the bumps.
To order a special bumped die thickness, describe your requirements in the SPECIAL-HANDLING parameter of your New Project, Fabrication, or Update Request.