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Number of die in a prototype lot and minimum size for cost calculation, by process.
Prototype Lot Quantities and Sizes
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Vendor
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Process
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Feature Size
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Minimum Size¹
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Number of Parts
In A Lot
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AMIS
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ABN
(CMOS)
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1.50 µm
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2.20 x 2.20 mm
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5
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4.60 x 4.70 mm
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15
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9.40 x 9.70 mm
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20
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C5 (CMOS)
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0.5 µm
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5 mm²
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40
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I2T100 (CMOS)
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0.7 µm
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10 mm²
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20
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I3T80
(CMOS)
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0.35 µm
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10 mm²
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20
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AMS
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C35 (CMOS)
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0.35 µm
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10 mm²
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40
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H35
(HV CMOS)
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0.35 µm
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10 mm²
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40
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S35
(SiGe BiCMOS)
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0.35 µm
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10 mm²
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40
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IBM
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5AM
(SiGe BiCMOS)
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0.50 µm
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15 mm²
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40
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5HP
(SiGe BiCMOS)
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0.50 µm
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15 mm²
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40
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5HPE
(SiGe BiCMOS)
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0.35 µm
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15 mm²
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40
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7RF (Mixed Mode)
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0.18 µm
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10 mm²
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40
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7WL
(SiGe BiCMOS)
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0.18 µm
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10 mm²
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40
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8RF-DM (Mixed Mode)
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0.13 µm
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10 mm²
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40
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8RF-LM (Logic)
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0.13 µm
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10 mm²
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40
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8HP (SiGe BiCMOS)
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0.13 µm
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10 mm²
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40
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8WL (SiGe BiCMOS)
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0.13 µm
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10 mm²
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40
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9LP (Low-power logic)
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90 nm
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16 mm²
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40
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9RF (Mixed Mode)
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90 nm
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16 mm²
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40
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9SF (Logic)
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90 nm
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16 mm²
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40
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10SF (Logic)
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65 nm
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12 mm²
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40
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10LPe (Low-power logic)
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65 nm
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12 mm²
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40
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TSMC
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CL035, CM035
(CMOS)
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0.35 µm
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25 mm²
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40
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CL025 (Logic)
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0.25 µm
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25 mm²
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40
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CM025 (Mixed Mode)
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0.25 µm
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25 mm²
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40
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CL018 (Logic)
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0.18 µm
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25 mm²
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40
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CM018 (Mixed Mode)
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0.18 µm
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25 mm²
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40
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CL013G (Logic)
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0.13 µm
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25 mm²
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40
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CR013G (Mixed Mode)
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0.13 µm
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25 mm²
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40
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¹ Minimum die size is for cost calculation. Submitted die can be
smaller and more die may be available for close to the same minimum
order cost.
Related Links
Fabrication Schedule
Customer Support
MOSIS Products
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