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Third Party Services Organizations offering products and services to the VLSI design community can ask to be added to this or the design-services-specific list. Send your request, a description of your company, and contact information to support@mosis.com. IC Assembly Services   Aspen Technologies   CORWIL Technology Corporation   Golden Altos   Promex Industries, Inc. Ceramic Packages   Chelsea Technology, Inc   Evergreen Semiconductor Materials, Inc   Global Chip Materials   Spectrum Semiconductor Materials, Inc. Plastic Packages (Fully Encapsulated)   ASAT   I2A Technologies (formerly IPAC) Plastic Packages (Open Cavity)   Quik-Pak   SEMPAC Test Sockets   Agile Enterprises Inc (formerly Mulvin & Company) Flip Chip Bumping In addition to the vendors below, flip chip bumping is also available for IBM and TSMC processes via the foundry. Contact support@mosis.com.   Flip Chip International   PacTech Die and wafer carriers   Entegris   GEL-PAK Testing Services   AccelerATE Solutions   ASAT   CORWIL Technology Corporation   Evans Analytical Group® (EAG)   microTEC   Nano Integrated Solutions, Inc.   SEAL Laboratories   Test Edge 3rd Party Design Services Please note MOSIS does not necessarily endorse the products and services listed on ths page. Related Links Third Party Design Services MOSIS FAQs: Packaging MOSIS Products

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